Research theme　－　Heat load and thermal stress due to fluid-structure interaction.

Temperature fluctuation phenomenon

Joint research group on thermal fatigue in collaboration with JAEA, INSS and NISA

Important point： High frequency temperature distribution is less likely to induce thermal stress due to the structure time delay to a temperature change on its surface, the heat does not transfer from fluid to surface. In another hand, at low frequency the structure has time to adapt to the temperature change and thermal stress is not likely to appears. However maximum thermal stress appears in intermediate frequency domain where both of these phenomena compete. by understanding these mechanism, focusing on frequency analysis clarify the phenomenon.

Joint research group on heat flow and structure interaction analysis in collaboration with JAEA, INSS and NISA

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• Safety and reliability of elevated temperature systems
• Analysis of thermal loadings and fatigue from fluid/structure interaction
• Inelastic behavior of elevated temperature designs

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• University of Tokyo
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  nuclear engineering and management
• Demachi laboratory
• Ishiwatari laboratory